M02300 - SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers Revision:SEMI M23-0623 - Current SEMI MF2074-0707 (technical revision)

SEMI MF2074-0707 (technical revision)

subsurface effects may play a more important scatter role than typically realized when surfaces are super polished

and also soluble in ether

This Document uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described herein

1  This Standard is to design and implement the measurement method of color breakup

M02300 - SEMI M23 - Specification for Polished Monocrystalline Indium Phosphide Wafers Revision:SEMI M23-0623 - Current SEMI MF2074-0707 (technical revision)This Specification covers the substrate requirements for monocrystalline high purity indium phosphide wafers used in semiconductor and electronic device manufacturing. Dimensional and crystallographic orientation characteristics are the only standardized properties set forth below. A complete purchase specification may require that additional physical, electrical, and bulk properties be defined. These properties are listed together with test methods