G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1112 FPD製造において利用される

FPD製造において利用される

4-0424 (technical revision)

이 표준은 능동 장비(예

本基準適用於無人搬運車及半導體工廠與平面顯示器工廠之無人搬運車系統。

The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability

G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1112 FPD製造において利用されるMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of