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Values of the scan obtained using this method are reported in Ra and Rq
which was calibrated previously using precise low-frequency substitution techniques as a reference standard
this Safety Guideline provides a prescriptive list of safety features to be incorporated in the PLHS
sensitivity to field-related problems increases
The Standard is not intended to identify all quality parameters
MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0306 - Superseded Values of the scan obtained1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide
