G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current 本スタンダードは，global Flat Panel Display –

本スタンダードは，global Flat Panel Display – Materials & Components Committeeで技術的に承認されている。現版は2011年7月1日，global Audits and Reviews Subcommitteeにて発行が承認された。2011年8月にwww

SEMI E64 — Specification for 300 mm Cart to SEMI E15

This reduced-pitch box

1節）的補充用

SEMI T7 — Specification for Back Surface Marking of Double-sided Polished Wafers with a Two-Dimensional Matrix Code Symbol

G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current 本スタンダードは，global Flat Panel Display –Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The