E14400 - SEMI E144 - 半導体製造装置および材料ハンドリング装置におけるキャリア内のRFIDタグとRFIDリーダの間の無線インタフェースの仕様 Revision:SEMI E144-0312 - Inactive 1 This Specification defines metrics

1  This Specification defines metrics and calculations for reporting equipment data quality

can reduce device manufacturing yields and degrade device or circuit performance

1  In this Standard

It was developed for use with silicon wafers of 150 mm diameter or less with standard diameter and fiducial positions as given in SEMI M1

Some terms are specialized to semiconductor facilities and equipment

E14400 - SEMI E144 - 半導体製造装置および材料ハンドリング装置におけるキャリア内のRFIDタグとRFIDリーダの間の無線インタフェースの仕様 Revision:SEMI E144-0312 - Inactive 1 This Specification defines metricsglobal Physical Interfaces & Carriers Technical Committee20111224global Audits and Reviews Subcommittee20123www. semiviews. org www. semi. org2005320063 RF2006100 % 134. 2 kHzHDX RFID RFID ISO IEC 18000 02 RFID 21) RI TRP DR2B HDX MPT2) ISO IEC 18000 02 Type B (HDX) Referenced SEMI Standards None.