C10300 - SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing Revision:SEMI C103-1021 - Current This Standard provides specification for

This Standard provides specification for implementing basic equipment performance tracking (EPT) for production equipment

1 The purpose of this Test Method is to provide an analytical procedure—ion mobility spectrometry (IMS)—for the determination of organic contamination from minienvironments which has the capability of testing their construction material

9-0698 (Reapproved 0615)

UPW parameters

SEMI M65 — Specifications for Sapphire Substrates to Use for Compound Semiconductor Epitaxial Wafers

C10300 - SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing Revision:SEMI C103-1021 - Current This Standard provides specification forThis Guide provides measurements and reporting of the parameters of disk aggressiveness, pad surface topography, disk surface topography and changes of the geometry of the disk features that are in contact with the pad during conditioning. This Guide provides measurements and reporting of the changes of aggressiveness and surface topography during the pad conditioning. This Guide provides for optimal sequence of the conditioning tests for multiple