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G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdPbc-0814 The purpose of this standard

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Description

The purpose of this standard is twofold: to enable applications software to be developed that can assume the existence of standard concepts

the pattern of measurement sites

and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

合成石英(SFS)

This Test Method can be used for silicon in which the impurity/dopant concentrations are between 0

G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdPbc-0814 The purpose of this standardThis Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1986; previously published in 1988. NOTICE: This Document was reapproved with minor editorial changes. The purpose of this test is to determine the thermal

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