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for research and development
Only the physical interfaces for the MRSP150 are specified
This Document is a basic guide for the use of seals in semiconductor fabrication equipment
where applicable
1 These methods may be used by suppliers and users of color filters for FPD applications
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers StdTpc-Package & Chip Carrier Tooling for research and developmentNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard specifies the front opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality. This Standard is intended to
