PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current use of the equipment requires

use of the equipment requires compliance with stringent safety regulations

previously published November 2004

This Specification defines communication and behavior between the production equipment and each subsystem to facilitate energy saving mode operation or sleep level management

SEMI E87 — Specification for Carrier Management

SEMI E111-1106 (technical revision)

PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current use of the equipment requiresWafer thickness and its variation across a wafer are important parameters for solar cell manufacturing. Excessive thickness variations within a lot from wafer to wafer or within a wafer may negatively impact process yield and solar cell efficiency. Both parameters are part of the specification for solar cell wafers (SEMI PV22), which define a thickness range as well as an upper limit for the total thickness variation (TTV). In addition, careful