G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package StdPbc-0117 This Test Method is suitable

This Test Method is suitable for measuring the bow and warp of wafers used in semiconductor device processing in the as-sliced

The data includes front-end (Wafer Processing

SEMI F81-0611 (technical revision)

This Practice makes no recommendations regarding the interpretation of the statistics that result from analysis of the data acquired with regard to the goodness or badness of given values of the test statistic

SEMI E33-94 (first published)

G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package StdPbc-0117 This Test Method is suitableNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. The purpose of this Document is to define a procedure for the size measurement method of solder spheres used for ball grid array (BGA) packages. This measurement method is applicable for solder spheres which are used for