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Initially available on SEMI OnLine August 1999
although reference is made to the more general case of two-dimensional measurements made over a rectangular array of data points
13-0698 (first published)
1 This Guide provides the tools to describe wafer stacks in a 3DS-IC process
This Document is a guide rather than a standard
E08700 - SEMI E87 - Specification for Carrier Management (CMS) Revision:SEMI E87-0921 - Superseded Initially available on SEMI OnLine* This Standard has the option to purchase the Current document with a Redline document (Current + Redline). The Redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the Redline document and the Current document, the Current version is the official and authoritative version. 1
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