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各前方サイドドメイン上の光学カセットセンシングホール （1）
This Guide is applicable to any type of equipment for processing semiconductor units
independent of which process module the current event report represents
• Carrier transfer between automated material handling system (AMHS) vehicles and production equipment load ports
Dimensional measurements made with an optical microscope are made on the optical image of the specimen and not directly on the specimen itself
P02900 - SEMI P29 - Specification for Characteristics Specific to Attenuated Phase Shift Masks and Masks Blanks Revision:SEMI P29-0997 - Superseded 各前方サイドドメイン上の光学カセットセンシングホール （1）This Specification covers the characteristics specific to attenuated phase shift masks and mask blanks. Referenced SEMI Standards SEMI P1 Specification for Hard Surface Photomask Substrates SEMI P2 Specification for Chrome Thin Films for Hard Surface Photomasks SEMI P22 Guideline for Photomask Defect Classification and Size Definition SEMI P28 Specification for Overlay Metrology Test Patterns for Integrated Circuit Manufacture
