Advanced Packaging including Heterogeneous Integration & Chiplets 6/25 StdVol-Equipment Automation Software This Test Method is an

This Test Method is an adaptation of ASTM G61

SEMI D19-1019 (technical revision)

각각의 재료 유형에 따라 프로세싱이 명시되어야만 한다

which describe the Die Strength Evaluation Method

7  Methods of measurements suitable for determining the characteristics in the Guide are indicated

Advanced Packaging including Heterogeneous Integration & Chiplets 6/25 StdVol-Equipment Automation Software This Test Method is anDates & Times June 25, 2026 8: 00 am 5 pm CT Early Bird $100 off Member $995 $895 Non Member $1095 $995 Location Aloft Tempe Meeting Room Tactic 951 East Playa Del Norte Drive Tempe, AZ 85281 480 621 3300 This one day course addresses IC packaging, assembly, and package substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i. e., smaller, better, cheaper and their influence on the