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Subassemblies
is essential to successful implementation of a wafer bonding process
originally published June 2000
and MGV equipment to the process tool
3 Manufacturing processes incorporating bonded wafers typically require thinned wafers
D04900 - SEMI D49 - Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position Revision:SEMI D49-0707 - Inactive SubassembliesThis standard was technically approved by the global Flat Panel Display Factory Automation Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 16, 2007. It was available at www. semi. org in June 2007. This standard is intended to further specify the single substrate ID reader position by specifying more clearly the orientation of single substrate for loading unloading indicated with a virtual datum
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