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本仕様は，Global Physical Interfaces & Carriers Committeeで技術的に承認されたもので，North American Physical Interfaces & Carriers Committeeが直接責任を負うものである。現版は2004年12月10日North American Regional Standards Committeeにて承認されている。2005年2月にまずwww
低レベルのデバイスの知性へのアクセス
The cleaning steps detailed in this Test Method are retained
이러한 서비스들은 객체 기반 데이터의 기본 관리를 허용한다
orgで入手可能になり，2004年7月発行に至る。初版は1986年発行，前版は1994年発行。
G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices StdPbc-310 本仕様は，Global Physical Interfaces & CarriersThis specification establishes uniform methods and procedures for conducting tests on lead finishes on (active device) electronic packages. Other SEMI Standards establish materials used and the finishes for them. Referenced SEMI Standards SEMI G4 Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G18 Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes SEMI G20 Lead Finishes for
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