P04700 - SEMI P47 - ラインエッジラフネス（Line Edge Roughness）およびライン幅ラフネス（Line Width Roughness）測定の試験方法 Revision:SEMI P47-0307 - Superseded chip to wafer

chip to wafer

SEMI E45 — Test Method for the Determination of Inorganic Contamination from Minienvironments Using Vapor Phase Decomposition-Total Reflection X-Ray Spectroscopy (VPD-TXRF)

SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive SingleCrystal

SEMI S2-0715a (delayed revision)

but in this case

P04700 - SEMI P47 - ラインエッジラフネス（Line Edge Roughness）およびライン幅ラフネス（Line Width Roughness）測定の試験方法 Revision:SEMI P47-0307 - Superseded chip to waferglobal Microlithography Committee20061121global Audits and Reviews Subcommittee20072www. semi. org20073CD ROM IC Referenced SEMI Standards SEMI P19 Specification for Metrology Pattern Cells for Integrated Circuit Manufacture SEMI P35 Terminology for Microlithography Metrology SEMI P36 Guideline of Magnification Reference for Critical Dimension Measurement Scanning Electron Microscopes