M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Revision:SEMI M70-1015 - Inactive Bare glass substrates which can

Bare glass substrates which can be used as facing substrates and color filter substrates

temperature

if it exists

This Specification provides for a standardized OC location in support of future unification of the OC cut shape as well as location

o multiple substrates where the substrates enter and exit the process module in a continuous flow where recipe execution for each substrate can be staggered

M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Revision:SEMI M70-1015 - Inactive Bare glass substrates which canWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer to determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable quantifying the near edge geometry of wafers used in semiconductor device processing. The PSFQR or PSFQD metric is suitable for quantifying near edge