3D00900 - SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack StdPbc-1114 It is the responsibility of

It is the responsibility of the user of these standards to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use

The purpose of this Document is to standardize requirements for hexamethyldisilazane used in the semiconductor industry and testing procedures to support those standards

stacked chip on substrate (SCoS)

SEMI D61-1110 (first published)

Online access to the most current fab data

3D00900 - SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack StdPbc-1114 It is the responsibility of1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure wafer stacks to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe wafer stacks in a 3DS IC process. A wafer stacking process takes two or more intermediate wafers and forms a stack, which can then be further processed as if it were a single wafer. After bonding the dimensions of