C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0319 6-95 (technical revision)

6-95 (technical revision)

With the growth of the photovoltaic market

See Related Information 1 appended to this Standard

SEMI F44-0699 (first published)

An analogous expression can be written for the whole emission rate

C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0319 6-95 (technical revision)The purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap