E13900 - SEMI E139 - Specification for Recipe and Parameter Management (RaP) Revision:SEMI E139-0705 - Superseded The specification defined by this

The specification defined by this Standard is applicable to the case for containing substrate materials used in FPD mask manufacturing process

The suggestions are specific to high purity silicon

material requirement

for plastic molded Single Outline Integrated Circuit (SOIC) semiconductor packages

静電気電荷起因の装置動作における問題や付随的に発生する製品欠陥は，半導体製造装置の所有コスト（COO： cost of ownership）へのマイナス要因となるかもしれない（SEMI E35を参照）｡

E13900 - SEMI E139 - Specification for Recipe and Parameter Management (RaP) Revision:SEMI E139-0705 - Superseded The specification defined by thisThis Standard was technically approved by the global Information & Control Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 16, 2009 Available at www. semiviews. org and www. semi. org in December 2011. Originally published March 2005; previously published March 2010. NOTICE: The designation of SEMI E139 was updated during the 1211 publishing cycle to reflect the changes to SEMI