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M07800 - SEMI M78 - Guide for Determining Nanotopography of Unpatterned Silicon Wafers High Volume Manufacturing StdPbc-0524 • Specifications from water-system equipment

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Description

• Specifications from water-system equipment manufacturers

The intent of this Standard is to facilitate the integration of IBSEM equipment into an automated (e

SEMI E12 — Guide for Standard Pressure

1  Purpose

Typical examples include dips

M07800 - SEMI M78 - Guide for Determining Nanotopography of Unpatterned Silicon Wafers High Volume Manufacturing StdPbc-0524 • Specifications from water-system equipmentFront surface wafer height variations over specified distances need to be properly controlled to assure that wafers are acceptable for selected process steps. Nanotopography parameters are included in the International Technology Roadmap for Semiconductors (ITRS) since 2003. Nanotopography on a wafer surface prior to chemical mechanical planarization (CMP) processes can result in variations of post CMP film thickness with potential negative

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