G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title It also provides for standardized

It also provides for standardized communication with lithography

This Standard includes the measuring

The purpose of this Document is to provide specification for hexafluoroethane (C2F6) that is used in the semiconductor industry

1  The purpose of this Standard is to standardize requirements for nitric acid used in the semiconductor industry and testing procedures to support those standards

本スタンダードはその使用に関連した全ての安全問題を取り扱うことを意図していない。このスタンダードの使用者は，その責任において，適切な安全及び健康上の作業方法を確立し，また使用前に規制上の制限への適用性を判断するものである。

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title It also provides for standardizedThis document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling