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35-1109 (technical revision)
health and safety (EH&S) issues associated with their use
• apex angles
reported in square meters surface area per kilogram mass (m2/kg)
The purpose of this Specification is to provide a generally applicable object model of semiconductor equipment structure and related elements
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdPbc-0318 35-1109 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History
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