G08900 - SEMI G89 - リードフレームのストリップ寸法の規格 Revision:SEMI G89-0211 - Superseded more than one array on

Name: G08900 - SEMI G89 - リードフレームのストリップ寸法の規格 Revision:SEMI G89-0211 - Superseded more than one array on
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Description

more than one array on a wafer may be defined and related to the same coordinate axes

It defines composition

This Test Method can be applied to manufacturing

本安全指導方針適用於與前開式晶圓傳送盒(FOUP)、標準機械介面(SMIF)傳送盒連接之承載埠與晶圓匣，及此類將整合至半導體生產設備者。

11-1105 (technical revision)

G08900 - SEMI G89 - リードフレームのストリップ寸法の規格 Revision:SEMI G89-0211 - Superseded more than one array onglobal Assembly & Packaging Committee20111221global Audits and Reviews Subcommittee20112www. semiviews. org www. semi. org Referenced SEMI Standards None.

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