HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) Revision:SEMI HB4-0913 (Reapproved 0419) - Superseded SEMI S22 — Safety Guideline

SEMI S22 — Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment

type of film or type of polish) that may affect the measured CR and FCR of an SSIS are to be agreed upon between suppliers and customers

SEMI M85 — Guide for the Measurement of Trace Metal Contamination on Silicon Wafers Surface by Inductively Coupled Plasma Mass Spectrometry

SEMI C23-0714 (Reapproved 0620)E

This object model is intended to be used in the following ways:

HB00400 - SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) Revision:SEMI HB4-0913 (Reapproved 0419) - Superseded SEMI S22 — Safety GuidelineThe purpose of this Standard is to define the equipment automation interface for communication and control of process, automation and metrology equipment used in high brightness light emitting diode (HB LED) manufacturing. It intends to produce economic benefits for both manufacturers and equipment suppliers by identifying a subset of relevant functionalities out of the existing SEMI Communications Standards for the application in HB LED manufacturing