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G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids StdTpc-300 mm Carriers & Physical Interfaces 2-0298 (technical revision)

SKU: 31597177828
4.1

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Description

2-0298 (technical revision)

SEMI C18-0714 (Reapproved 0620)

setting test patterns

which may be applied with due caution to systems intended for use in other gas applications

25 mm/182 mm ± 0

G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids StdTpc-300 mm Carriers & Physical Interfaces 2-0298 (technical revision)This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0. 050" pad centerline. The SLAM package is covered separately in SEMI G5. Referenced SEMI Standards None.

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