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SEMI M1 — Specifications for Polished Single Crystal Silicon Wafers
scanning surface inspection systems (SSIS)
SEMI C36-1213 (technical revision)
This Test Method includes procedures for establishing the repeatability of the test equipment under the conditions of measurement
This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength Revision:SEMI G63-95 (Reapproved 0811) - Superseded SEMI M1 — Specifications forThe purpose of this Test Method is to determine procedures for die shear strength testing. This Test Method shall be used for the measurement of the die shear strength when die attach paste film is used to bond a die to a leadframe substrate bond pad. This Test Method shall be used for quality control and development at die attach paste film suppliers and for incoming inspection and selection of the die attach paste film at die attach paste film
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