G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0997 (Reapproved 1104) - Superseded This scope also extends to

This scope also extends to interbay AMHS active equipment (i

This Guide logically follows the series of SEMI Standards developed for UPW

SEMI E18 — Guide for Temperature Specifications of the Mass Flow Controller

000 records of front-end semiconductor fabs and foundries such as TSMC

本試験方法は，global Compound Semiconductor Committeeで技術的に承認されている。現版は2005年11月29日，global Audits and Reviews Subcommitteeにて発行が承認された。2006年1月にwww

G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0997 (Reapproved 1104) - Superseded This scope also extends toThis Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.