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The details of any underlying concepts and behavioral models (e
a device to a carrier wafer) or permanently bonded
optical characteristics (single transmittance
use of the sequence of procedures in SEMI MF1726
ROA and PSFQR
G05500 - SEMI G55 - リードフレーム銀めっき光沢度の測定方法 Revision:SEMI G55-93 (Reapproved 0811) - Superseded The details of any underlyingglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1993200411 : Referenced SEMI Standards SEMI G21 Specification for Plating Integrated Circuit Leadframes
