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The edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot
The specification and test methods details in this Document apply to mold resin compounds which is used for packaging
This Document accomplishes this by defining an operational model for prober equipment as viewed by a factory automation controller
When this is done
1-0304 (technical revision)
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Revision:SEMI M68-0720 - Current The edges of circular wafersWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The metric, ZDD, quantifies the near edge curvature of wafers used in semiconductor device processing. Consideration should be given to the use of this or other proposed
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