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this TDDB test method has a higher sensitivity for detecting the accidental breakdown (B mode) than TZDB
and MGV equipment to the process tool
試験記録書の記載内容
SEMI G89-0211 (Reapproved 0823)
at which time they may be classified as defects or non-defects
G06500 - SEMI G65 - Lリード（ガルウイング型）パッケージ用リードフレーム材料の評価の試験方法 StdPbc-0914 this TDDB test method hasglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : L Referenced SEMI Standards None.
