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The SECS-I Standard defines a communication interface suitable for the exchange of messages between semiconductor processing equipment and a host
and charged particle activation analysis
module requirement
3 This Guide lists the impurities typically found in polycrystalline silicon
on or beneath the surface of silicon wafers prior to any heat treatment of the wafer
G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造 Revision:SEMI G1-96 - Inactive The SECS-I Standard defines aCurrentInactiveInactiveSEMI 1996 CerDIP CerDIP 2 Referenced SEMI Standards SEMI G2 Specification Metallic Leadframes for Cer Dip Packages SEMI G20 Specification Lead Finishes for Plastic Packages (Active Devices only) SEMI G23 Test Method Measuring the Inductance of Package Leads SEMI G24 Test Method Measuring the Lead to Lead and Loading Capacitance of Package Leads SEMI G25 Test Method Measuring the Resistance of Package Leads SEMI G30 Test Method
