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org에서 열람 가능하다
or measuring techniques
本仕様では，
the applicability of this specification is not restricted or limited to this region alone
3 In addition
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages Revision:SEMI G68-0996 (Reapproved 1104) - Superseded org에서 열람 가능하다The purpose of this Test Method is to determine the thermal resistance of semiconductor packages using thermal test chips. This Test Method deals with junction to case measurements of thermal resistance in air environment. The results of this Test Method are used to obtain the junction temperature. The measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43. This
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