G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 0318) - Inactive The purpose of this Standard

The purpose of this Standard is to introduce Wafer Flow Job (WFJ) in order to manage multiple WJs in the equipment

This Standard provides guidance on maintenance

SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages

SEMI E151 — Guide for Understanding Data Quality

·    Chemical mechanical polishing/planarization equipment

G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 0318) - Inactive The purpose of this StandardThis Document provides the requirements for a standard thermal resistance test board to be used in junction to ambient thermal resistance measurement of a semiconductor package under still and forced air condition as a referee method. This Document describes the thermal resistance test board for measurement of the following packages: Dual In Line Packages (DIP), Plastic Chip Carrier Package (PCC), Quad Flat Package (QFP), Pin Grid Array Package (PGA),