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Temporary bonding uses a temporary adhesive that can be reversed using a chemical
本テスト方法はフラットパネルディスプレイ（
2 This Guide covers specification requirements
SEMI E132-1214 (technical revision)
3 cm (8 in
F10500 - SEMI F105 - Guide for Metallic Material Compatibility in Gas Distribution Systems StdTpc-XML Temporary bonding uses a temporaryThe purpose of this Guide is to document the industry acceptable compatibility of metallic materials with semiconductor process gases. This Guide is applicable to metallic materials that are exposed to process gases within the gas distribution systems of semiconductor manufacturing equipment. It is not applicable to high pressure, bulk delivery systems. This Guide is specific to High Purity and Ultra High Purity chemical delivery systems. Referenced
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