Semiconductor Hazardous Energy Control Part 2 StdPbc-1122 and their customers in evaluating

and their customers in evaluating leadframe tapes

and Maintainability (RAM) and UtilizationSEMI E19 — Specification for Standard Mechanical Interface (SMIF)SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)SEMI E37 — High Speed SECS Message Services (HSMS) Generic ServicesSEMI E47 — Specification for 150 mm/200 mm Pod HandlesSEMI E47

E 本スタンダードは2004年9月，編集上の誤りを修正するため改訂された。表2および3で変更がなされている。

本スタンダードは，global Micropatterning Committeeで技術的に承認されている。現版は2008年8 月29日，global Audits and Reviews Subcommitteeにて発行が承認された。2008年10月にwww

SEMI MF525-00a (first SEMI publication)

Semiconductor Hazardous Energy Control Part 2 StdPbc-1122 and their customers in evaluatingCourse Description Think safety first when working within semiconductor fabrication units. Take this course to learn about the physical methods used to control hazardous energy found in your work area. Also, learn about SEMI safety guidelines for interlock systems and hazardous energy isolation. Ideal learners are semiconductor fabrication workers, especially authorized employees. Course Objectives Choose the correct energy isolation method for