G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1121 and size of the photomask

and size of the photomask defects

SEMI PV90-0319 (Reapproved 0925)

多くのデバイスメーカーが，シリコンアニールウェーハを用いてデバイス特性の向上を図っている。本仕様が提供するのは，半導体デバイスおよび集積回路組立てに使用されるシリコンアニールウェーハを規定するための情報である。

9995% or higher

Cancellation and Rescheduling Policies

G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1121 and size of the photomaskMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of